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CCMs are developing towards smaller sizes and lower costs. However, traditional CCM assembly methods are restricted by materials and technology, and there are bottlenecks in terms of product cost control. As a result, wafer-level camera modules have emerged. Wafer-level camera modules make use of semiconductor production processes to manufacture optical components, and are integrated with the image sensor.
This process can enable companies to achieve their goals of making modules smaller and lowering prices. Large-scale production and low prices will threaten existing camera module makers, and could also lead to changes in the CCM industry supply chain. However, a challenge for wafer-level modules is yield rate, which will have to increase significantly before they will have a significant impact.
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